| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
60 pcs
|
60 pcs | On Request | 1 | On Request | On Request | N/A | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| Operating Temperature | |
| SVHC Present |
The NXP Semiconductors XPC850DECZT50BU is a 32-bit microprocessor based on the MPC8xx core, operating at a speed of 50MHz. This component features a 256-PBGA (23x23) package and is designed for surface mounting.
Key specifications include a 1-core architecture, 3.3V I/O voltage, and support for various interfaces such as HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, and UART/USART. It also includes 10Mbps Ethernet and USB 1.x connectivity. The operating temperature range is -40°C to 95°C (TA).
This microprocessor is suitable for embedded systems requiring robust processing capabilities and a wide array of communication interfaces. Its surface mount package facilitates integration into compact electronic designs.
-40°C to 95°C.
256-BGA (256-PBGA, 23x23mm).
3.3V.
Yes, one 10Mbps Ethernet interface.
Yes, one USB 1.x interface.
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART.
Communications coprocessor (CPM).