BC847B/215
Nexperia USA Inc.
The Nexperia USA Inc. BC847B/215 is a bipolar transistor. It is RoHS3 Compliant and has an MSL Level 1 rating.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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5 pcs
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5 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| SVHC Present |
The XHFC-1SU by Cologne Chip is an Extended ISDN HDLC FIFO controller designed for universal ISDN port applications. This component is housed in an LQFP 64 package, suitable for surface mount assembly.
The device's packaging and handling requirements are detailed, including a Moisture Sensitivity Level (MSL) of 3. Recommended soldering reflow profiles for both Sn-Pb eutectic and Pb-free assembly are provided, aligning with JEDEC Standard JSTD-020C. Specific temperature and time parameters for preheating, reflow, and ramp-down rates are outlined to ensure optimal surface mounting quality.
Environmental compliance information indicates RoHS3 compliance and REACH unaffected status. The product is also classified as Lead Free. Handling precautions for moisture-sensitive devices are emphasized, recommending that vacuum packs be opened only shortly before soldering to prevent moisture absorption and potential cracking during thermal stress.
Packaging details specify that chips are packed on trays, with 160 chips per tray. Ten trays are contained within a vacuum pack, totaling 1600 chips. Each vacuum pack is placed in a small box, constituting one lot. The dimensions of the packaging are 36 cm x 15.4 cm x 7 cm, with a weight of 2.1 kg.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.32 | $1.32 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XHFC-1SU is available in an LQFP 64 package.
The Moisture Sensitivity Level (MSL) for the XHFC-1SU is MSL 3.
The minimum rebake condition for the XHFC-1SU is 125°C for 24 hours.
The XHFC-1SU is RoHS3 Compliant.
The XHFC-1SU is REACH Unaffected.
The XHFC-1SU is packaged on trays, with 160 chips per tray. Ten trays are inside a vacuum pack, totaling 1600 chips. Each vacuum pack is put into a small box.