| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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402 pcs
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402 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XCZU4CG-1FBVB900I by AMD is a high-performance FPGA System on Chip (SoC) designed for embedded applications. It integrates powerful processing cores, including Dual ARM Cortex-A53 MPCore processors and Dual ARM Cortex-R5 processors, alongside extensive FPGA fabric with over 192,000 logic cells.
This device offers a RAM size of 256KB and operates at speeds of 500MHz and 1.2GHz. It features 204 I/O pins, supporting various connectivity options such as CANbus, Ethernet, I2C, SPI, and USB OTG. Peripherals like DMA and WDT are also included, enhancing its functionality for complex designs.
The XCZU4CG-1FBVB900I is housed in a 900-BBGA, FCBGA package, suitable for surface mounting. It is designed to operate reliably within a wide temperature range of -40°C to 100°C (TJ).
This FPGA SoC is compliant with RoHS3 standards and is REACH Unaffected, making it suitable for a variety of industrial and commercial applications. Its architecture combines MCU and FPGA capabilities, offering flexibility for diverse system requirements.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.72 | $4.72 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is -40°C to 100°C (TJ).
The RAM size is 256 KB.
It features Dual ARM Cortex-A53 MPCore with CoreSight and Dual ARM Cortex-R5 with CoreSight processors.
The device has 204 I/O pins.
The package type is 900-BBGA, FCBGA.