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70 pcs
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70 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This System On Chip (SoC) from Advanced Micro Devices, part number XCZU3CG-1SFVA625E, integrates a powerful processing core with FPGA fabric. It features Dual ARM Cortex-A53 MPCore™ processors and Dual ARM Cortex™-R5 processors, offering a versatile architecture for complex embedded applications.
The device operates within a temperature range of 0°C to 100°C (TJ) and includes 256KB of RAM. Its connectivity options are extensive, supporting CANbus, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
Packaged in a 625-FCBGA (21x21) or 625-BFBGA, FCBGA, this SoC is designed for demanding applications requiring both processing power and hardware acceleration capabilities. The Zynq®UltraScale+™ architecture provides over 154K logic cells, making it suitable for advanced embedded systems.
Key specifications include a speed of 500MHz and 1.2GHz, along with peripherals like DMA and WDT. The RoHS3 compliant status indicates adherence to environmental regulations.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is 0°C to 100°C (TJ).
It uses Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM®Cortex™-R5 with CoreSight™.
The device has 256KB of RAM.
Connectivity includes CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
The package is 625-FCBGA (21x21) or 625-BFBGA, FCBGA.