| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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15 pcs
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15 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XCVU9P-2FLGA2104I is a Virtex® UltraScale+™ FPGA from AMD, engineered for high-speed and complex computing tasks. It boasts a substantial logic capacity with 2,586,150 system logic cells, 1,182,240 CLB LUTs, and 2,364,480 CLB flip-flops, making it suitable for large-scale designs.
This FPGA offers extensive memory resources, including 75.9 Mb of Block RAM and 270 Mb of UltraRAM, totaling approximately 346 Mb of on-chip storage. It features 120 GTY transceivers operating at 32.75 Gb/s for high-speed serial data transfer and provides 416 versatile I/O pins supporting various standards. The device operates within an industrial temperature range of -40°C to +100°C (TJ).
Packaged in a 2104-ball Flip-Chip BGA (47.5 mm x 47.5 mm), the XCVU9P-2FLGA2104I is built on 20nm FinFET technology. Its advanced architecture and features make it ideal for applications such as 5G infrastructure, high-performance data centers, AI acceleration, and industrial automation, where instant processing and massive data throughput are critical.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XCVU9P-2FLGA2104I has 2,586,150 system logic cells.
The operating temperature range for the XCVU9P-2FLGA2104I is -40°C to 100°C (TJ).
The voltage range for the XCVU9P-2FLGA2104I is 0.825V to 0.876V.
The XCVU9P-2FLGA2104I is in a 2104-BBGA, FCBGA package.
The XCVU9P-2FLGA2104I has 416 I/O pins.