| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
177 pcs
|
177 pcs | On Request | 1 | On Request | On Request | 1321+ | On Request | On Request | |
|
1 pcs
|
1 pcs | On Request | 1 | On Request | On Request | 02+45 | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| Operating Voltage | |
| SVHC Present |
The Xilinx XCV400E6FG676C is a high-performance Field Programmable Gate Array (FPGA) designed for embedded applications. It features 400,000 logic elements and supports a total of 207,360 RAM bits, providing significant capacity for complex digital designs.
This FPGA offers 320 I/O pins, allowing for extensive interfacing with other system components. It is designed to operate across a voltage range of 1.35V to 1.8V, offering flexibility in power management. The operating temperature range is from 0°C to 85°C.
The XCV400E6FG676C comes in a 676-BGA (Ball Grid Array) package with a surface mount type. It is classified as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited shelf life under recommended conditions. The REACH status is unaffected.
This component is suitable for a wide array of applications requiring custom logic and high-speed processing, such as digital signal processing, communication systems, and complex control logic.
| Qty | Low | High |
|---|---|---|
| 1+ | $22.15 | $22.15 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XCV400E6FG676C has 400,000 logic elements.
The XCV400E6FG676C has a total of 207,360 RAM bits.
There are 320 I/O pins available on the XCV400E6FG676C.
The XCV400E6FG676C can operate at 1.35V, 1.5V, or 1.8V.
The operating temperature range is 0°C to 85°C.
The XCV400E6FG676C is in a 676-BGA package.
The mounting type is Surface Mount.