| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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2,260 pcs
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2260 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XCV300E-7FG256I is a Field Programmable Gate Array (FPGA) from Advanced Micro Devices (formerly Xilinx). It provides 6912 logic elements, 176 user I/O pins, and 131072 bits of embedded RAM, with a total of 411955 gates. The device operates on a supply voltage of 1.71V to 1.89V and is rated for junction temperatures from -40°C to 100°C. It is housed in a 256-ball BGA package (256-FBGA, 17x17mm) and uses surface mount technology. This FPGA is suitable for a wide range of digital logic applications requiring reconfigurable hardware, including interface bridging, control logic, and prototyping. The part is RoHS3 compliant (unverified) and has an MSL of 1. Note that the datasheet currently available is for a different part number, so design engineers should verify specifications from an authoritative source.
The XCV300E-7FG256I has 6912 logic elements.
It has 176 user I/O pins.
The supply voltage range is 1.71V to 1.89V.
The package is 256-BGA (256-FBGA 17x17).
It has 131072 bits (128 Kb) of RAM.
The junction temperature range is -40°C to 100°C.
It has 411,955 gates.