| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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452 pcs
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452 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
53 pcs
|
53 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The AMD Xilinx XCV1000E-6FG680C is a high-density, 1.8V FPGA designed for low-power operation. It features a flexible architecture balancing speed and density, with 1.57 million system gates and 27,648 logic elements. The device offers 512 I/O pins and supports various high-performance interface standards.
Key features include 1 Mb of internal configurable distributed RAM and up to 832 Kb of synchronous internal block RAM with true dual-port capability. The FPGA boasts high-performance clock management circuitry with eight digital Delay-Locked Loops (DLLs). It is manufactured using a 0.18 μm 6-layer metal process.
This FPGA is suitable for applications requiring high logic density and I/O flexibility. It is designed for surface mount installation and comes in a 680-LBGA exposed pad package (680-FTEBGA).
Specifications include an operating temperature range of 0°C to 85°C (TJ) and an operating voltage of 1.71V to 1.89V. The device supports differential signaling standards like LVDS, BLVDS, and LVPECL.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XCV1000E-6FG680C has 27,648 logic elements.
The XCV1000E-6FG680C features 512 I/O pins.
The operating voltage for the XCV1000E-6FG680C is between 1.71V and 1.89V.
The XCV1000E-6FG680C is supplied in a 680-LBGA Exposed Pad package.
The XCV1000E-6FG680C has an internal performance of 130 MHz.
The XCV1000E-6FG680C has a total of 393,216 RAM bits.