| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,500 pcs
|
2500 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
23 pcs
|
23 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Spacing | |
| Mounting Type | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Tape & Reel | |
| Total RAM Bits | |
| Voltage |
The XCKU3P-2FFVB676I is a Field Programmable Gate Array (FPGA) from Advanced Micro Devices. This component features 280 I/O pins and a substantial 355950 logic elements, along with 31,641,600 total RAM bits.
Designed for surface mount applications, it comes in a 676-FCBGA package. The operating temperature range for this FPGA is -40°C to 100°C (TJ), and it operates at a voltage between 0.825V and 0.876V.
This FPGA is suitable for various embedded applications requiring high logic density and I/O capabilities. Its robust design and operating parameters make it a reliable choice for complex digital systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
-40°C to 100°C (TJ)
280
31641600
355950
676-BBGA, FCBGA
Surface Mount