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XC7Z030-1FBG676I The XC7Z030-1FBG676I is a system on chip with dual ARM Cortex-A9 cores operating at 667MHz. It includes 256KB RAM and features a 676-FCBGA package suitable for embedded applications.
Mfr Part #:

XC7Z030-1FBG676I

Available from 1 distributors
Mfr Name: Advanced Micro Devices
Advanced Micro Devices
The XC7Z030-1FBG676I is a system on chip with dual ARM Cortex-A9 cores operating at 667MHz. It includes 256KB RAM and features a 676-FCBGA package suitable for embedded applications.
✓ Total Stock: 312 pcs
$ Price Range: $0.99

XC7Z030-1FBG676I Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Romaks Technologies ✓
Non-Authorised Inventory information
312 pcs
On Request
312 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

XC7Z030-1FBG676I Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Architecture
Connectivity
Core Processor
Lead Spacing
Operating Temperature
Peripherals
Primary Attributes
RAM Size
Speed
Supplier Device Package
Tape & Reel
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XC7Z030-1FBG676I Description

Short technical summary and product information.

The XC7Z030-1FBG676I is an integrated circuit from Advanced Micro Devices, categorized as a system on chip (SoC). It features a dual ARM Cortex-A9 MPCore processor with CoreSight technology, running at 667MHz. The device includes 256KB of RAM and supports peripherals such as DMA, CANbus, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The package type is 676-FCBGA measuring 27x27mm, designed for embedded applications requiring high processing power and connectivity. It complies with RoHS3 standards, has an MSL of 1 (Unlimited), and is unaffected by REACH regulations. This component is suitable for use in embedded systems, industrial automation, and other high-performance applications requiring a compact, reliable package.

XC7Z030-1FBG676I Quick Information

Product Type: System on Chip (SoC)
Canonical Name: XC7Z030-1FBG676I

XC7Z030-1FBG676I Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XC7Z030-1FBG676I Estimated Pricing

Qty Low High
1+ $0.99 $0.99

Estimated market price range - modelled values for guidance only, not live distributor offers.

XC7Z030-1FBG676I Features

  • Dual ARM Cortex-A9 MPCore processors
  • Operates at 667MHz
  • Includes 256KB RAM
  • 676-FCBGA package for embedded use
  • Supports multiple connectivity interfaces

XC7Z030-1FBG676I Applications

  • Embedded systems requiring high processing power
  • Industrial automation applications
  • Communication equipment
  • Aerospace embedded systems

XC7Z030-1FBG676I FAQs

4 frequently asked questions generated from this part’s specifications.
What is the operating temperature range of the XC7Z030-1FBG676I?

The operating temperature range is -40°C to 100°C.

Is the XC7Z030-1FBG676I RoHS compliant?

Yes, it is RoHS3 compliant.

What is the package type of this component?

The package type is 676-FCBGA (27x27mm).

Does this component support USB OTG connectivity?

Yes, it supports USB OTG connectivity.

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