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XC7K70T-2FBG676C The XC7K70T-2FBG676C is an FPGA with 300 I/O pins and a 676FBGA package. It is designed for embedded circuit applications.
Mfr Part #:

XC7K70T-2FBG676C

Available from 1 distributors
Mfr Name: Advanced Micro Devices
Advanced Micro Devices
The XC7K70T-2FBG676C is an FPGA with 300 I/O pins and a 676FBGA package. It is designed for embedded circuit applications.
✓ Total Stock: 200 pcs
$ Price Range: $21.20

XC7K70T-2FBG676C Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Components Technology Group, Inc. ✓
Non-Authorised Inventory information
200 pcs
On Request
200 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

XC7K70T-2FBG676C Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Supplier Package
Tape & Reel
Total RAM Bits
Voltage
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XC7K70T-2FBG676C Description

Short technical summary and product information.

The XC7K70T-2FBG676C is a field-programmable gate array (FPGA) manufactured by Advanced Micro Devices. It features 300 input/output pins and is housed in a 676-ball FCBGA package. This FPGA is suitable for embedded system designs requiring high I/O count and flexible logic implementation.

 

The device supports a total of 6,976,640 RAM bits and 65,600 logic elements, making it suitable for complex digital logic applications. Its surface-mount design allows for easy integration into printed circuit boards, with a package size of 27x27 mm. The FPGA operates within a voltage range of 0.97V to 1.03V and can withstand temperatures from 0°C to 85°C.

 

Designed for high-performance embedded applications, this FPGA can be used in telecommunications, data processing, and industrial automation. Its package type, FCBGA, ensures reliable mounting on surface-mount PCB assemblies, supporting high-density designs.

 

Environmental compliance data indicates RoHS3 compliance, though this is low-confidence, and the device has a Moisture Sensitivity Level of 1, with similar low-confidence status. The device's specifications make it suitable for applications demanding high I/O and logic capacity in embedded systems.

XC7K70T-2FBG676C Quick Information

Product Type: FPGA (Field Programmable Gate Array)
Canonical Name: IC FPGA 300 I/O 676FBGA

XC7K70T-2FBG676C Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XC7K70T-2FBG676C Estimated Pricing

Qty Low High
1+ $21.20 $21.20

Estimated market price range - modelled values for guidance only, not live distributor offers.

XC7K70T-2FBG676C Features

  • Supports 300 I/O pins for high connectivity
  • Contains 65,600 logic elements for complex logic
  • Operates within 0.97V to 1.03V voltage range
  • Housed in a 676-ball FCBGA package
  • Temperature range from 0°C to 85°C

XC7K70T-2FBG676C Applications

  • Ideal for embedded digital logic systems
  • Used in telecommunications equipment
  • Suitable for industrial automation projects
  • Supports high-density PCB designs

XC7K70T-2FBG676C FAQs

5 frequently asked questions generated from this part’s specifications.
How many logic elements does the XC7K70T-2FBG676C have?

It has 65,600 logic elements.

What is the I/O pin count for this FPGA?

It supports 300 I/O pins.

What is the operating voltage range?

The device operates within 0.97V to 1.03V.

What package type does this FPGA use?

It uses a 676-ball FCBGA package.

What is the operating temperature range?

It operates from 0°C to 85°C.

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