| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1,500 pcs
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1500 pcs | On Request | 1 | On Request | On Request | 17+ | On Request | On Request | |
| On Request | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XC7K325T-2FFG676C is a Field Programmable Gate Array (FPGA) manufactured by AMD. This device offers a high logic density with 326,080 logic elements and 25,475 LABs/CLBs, making it suitable for complex computational tasks. It provides extensive connectivity with 400 I/O pins and a substantial RAM capacity of 16,404,480 bits, supporting data-intensive applications.
The FPGA operates within a supply voltage range of 0.97V to 1.03V and has an operating temperature range of 0°C to 85°C (TJ). It is packaged in a 676FCBGA format and designed for surface mount applications. The XC7K325T-2FFG676C is RoHS3 compliant and REACH unaffected, meeting stringent environmental and safety standards.
AMD provides comprehensive development tools, including the Xilinx Vivado Design Suite, IP Integrator, and Xilinx SDK, to facilitate design and implementation. Its high logic density, extensive I/O capability, and large RAM capacity make it ideal for applications in high-performance computing, telecommunications, industrial automation, medical imaging, and aerospace and defense.
The XC7K325T-2FFG676C FPGA has 326,080 logic elements.
The XC7K325T-2FFG676C has 400 I/O pins.
The operating voltage range for the XC7K325T-2FFG676C is 0.97V to 1.03V.
The operating temperature range for the XC7K325T-2FFG676C is 0°C to 85°C (TJ).
The XC7K325T-2FFG676C is supplied in a 676FCBGA package.
The Moisture Sensitivity Level (MSL) for the XC7K325T-2FFG676C is Level 4 (72 hours).