| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,800 pcs
|
1800 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
603 pcs
|
603 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Lead Spacing | |
| Lead Style | |
| Medical Grade | |
| Military Grade | |
| Mounting Type | |
| Number of I | |
| Number of I/O | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| SVHC Present | |
| Storage Temperature | |
| Supplier Device Package | |
| Tape & Reel | |
| Total RAM Bits | |
| Voltage |
The XC7K160T-2FFG676C is a Field Programmable Gate Array (FPGA) from AMD, part of the Kintex-7 family. This device features 162,240 logic elements and 12,675 Logic Array Blocks (LABs), providing significant capacity for complex digital designs.
It offers 11,980,800 total RAM bits for on-chip data storage and includes 400 Input/Output (I/O) pins for interfacing with other system components. The operating voltage range is specified as 0.97V to 1.03V, with a typical operating temperature range of 0°C to 85°C (TJ).
This FPGA is supplied in a 676-FCBGA (Flip Chip Ball Grid Array) package, measuring 27x27mm, designed for surface mounting. The package type is 676-BBGA, FCBGA.
Environmental compliance includes RoHS3 compliance, MSL 1, and REACH Unaffected status, though these are currently unverified.
The XC7K160T-2FFG676C has 162,240 logic elements.
This FPGA has a total of 11,980,800 RAM bits.
There are 400 I/O pins available on this device.
The operating voltage is between 0.97V and 1.03V.
It is supplied in a 676-FCBGA (27x27) package.
The operating temperature is 0°C to 85°C (TJ).