| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,030 pcs
|
2030 pcs | On Request | 1 | On Request | On Request | 24+ | On Request | On Request | |
|
29 pcs
|
29 pcs | On Request | 1 | On Request | On Request | 18+22+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Contact Plating | |
| Lead Style | |
| Mounting Style | |
| Number of Pins | |
| Package / Case | |
| RAM Size | |
| Voltage |
The Xilinx XC6VLX75T-1FFG784I is a high-performance Field Programmable Gate Array (FPGA) designed for demanding applications. This device offers 74496 logic elements and 5820 logic blocks, providing significant processing power.
Key electrical specifications include a RAM size of 702kB and 360 I/O pins, supporting flexible system integration. The operating voltage is 1V, with a minimum supply voltage of 0.95V and a maximum of 1.05V. The device operates reliably across a wide temperature range, from -40°C to 100°C.
Packaged in an FCBGA (Flip-Chip Ball Grid Array) format, the XC6VLX75T-1FFG784I is designed for surface mounting. Its 784 pins ensure ample connectivity for complex designs. The contact plating is a combination of Copper, Silver, and Tin, ensuring robust electrical connections.
The XC6VLX75T-1FFG784I has a RAM size of 702kB.
The XC6VLX75T-1FFG784I has 360 I/O pins.
The operating voltage for the XC6VLX75T-1FFG784I is 1V.
The XC6VLX75T-1FFG784I comes in a FCBGA package and is surface mounted.
The XC6VLX75T-1FFG784I operates between -40°C and 100°C.
The XC6VLX75T-1FFG784I has 74496 logic elements.