XC6SLX75T-3FGG676I
Advanced Micro Devices
The Advanced Micro Devices XC6SLX75T-3FGG676I is an FPGA with 74,637 logic elements and 348 I/O pins. It features a surface mount package.
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226 pcs
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226 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XC6SLX75T-3FG676I is a field programmable gate array (FPGA) manufactured by AMD. It features 74,637 logic elements and 5,831 logic array blocks, making it suitable for complex digital logic applications. The device includes a total of 3,170,304 RAM bits and 348 I/O pins, supporting extensive interfacing options.
Designed for embedded systems, this FPGA comes in a 676-ball BGA package with a surface mount mounting type. It operates within a temperature range of -40°C to 100°C and has an operating voltage between 1.14V and 1.26V. Its high logic capacity and I/O count make it appropriate for applications requiring high-density logic integration.
The device is compliant with RoHS standards, although this status is unverified. It also has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited reflow cycles, but this information is unverified. The FPGA is intended for use in embedded system designs, including digital signal processing, communications, and industrial automation.
Order this FPGA for projects requiring high logic density, multiple I/O, and surface mount installation in a compact BGA package.
| Qty | Low | High |
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| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The FPGA has 74,637 logic elements.
It comes in a 676-BGA package.
-40°C to 100°C.
It has 348 I/O pins.
The operating voltage is between 1.14V and 1.26V.