| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1,800 pcs
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1800 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
1,700 pcs
|
1700 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XC6SLX45-2FGG484C is a field-programmable gate array (FPGA) manufactured by Advanced Micro Devices. It features 316 input/output pins and is housed in a 484-ball fine ball grid array (FBGA) package. The device is designed for embedded systems requiring high I/O count and flexible logic implementation.
This FPGA supports surface mounting and is used in applications such as digital signal processing, communications, and embedded control systems. Its package dimensions are 23x23 mm, compatible with surface-mount technology.
The device's specifications include a total of 43,661 logic elements, 2,138,112 RAM bits, and 3,411 logic array blocks. It operates within a temperature range of 0°C to 85°C and a voltage range of 1.14V to 1.26V. It is RoHS3 compliant and has a moisture sensitivity level of 1, with an unlimited lead time noted.
Designed for high-performance digital applications, this FPGA provides a versatile platform for complex logic designs, with a focus on embedded system integration.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XC6SLX45-2FGG484C has 316 I/O pins.
The package type is 484-BBGA in a 484-FBGA (23x23) package.
It operates between 0°C and 85°C.
The voltage range is 1.14V to 1.26V.
It contains 43,661 logic elements.