XC6SLX25-3FTG256I The XC6SLX25-3FTG256I is an FPGA with 186 I/O pins, packaged in a 256-FTBGA form factor, designed for embedded applications.
Mfr Part #:

XC6SLX25-3FTG256I

Available from 1 distributors
Mfr Name: Advanced Micro Devices
Advanced Micro Devices
The XC6SLX25-3FTG256I is an FPGA with 186 I/O pins, packaged in a 256-FTBGA form factor, designed for embedded applications.
✓ Total Stock: 2,782 pcs
$ Price Range: $21.20

XC6SLX25-3FTG256I Available from 1 distributor

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✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
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2,782 pcs
2782 pcs On Request 1 On Request On Request On Request On Request On Request

XC6SLX25-3FTG256I Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Supplier Package
Total RAM Bits
Voltage

XC6SLX25-3FTG256I Description

Short technical summary and product information.

The XC6SLX25-3FTG256I is an FPGA device manufactured by Advanced Micro Devices. It features 186 input/output pins and is housed in a 256-FTBGA package measuring 17x17 mm. This FPGA is suitable for embedded system designs requiring high I/O count and flexible programmable logic. Its package mounting type is surface mount, compatible with standard PCB assembly processes.

 

The device's specifications include a wide operating temperature range from -40°C to 100°C and an operating voltage between 1.14V and 1.26V. It contains 24,051 logic elements, 958,464 total RAM bits, and 1,879 logic array blocks. These features make it suitable for complex digital logic applications, including signal processing, communications, and control systems.

 

Designed for embedded applications, this FPGA supports high-density logic implementation and multiple I/O configurations. Its surface-mount package facilitates reliable mounting on printed circuit boards, making it ideal for space-constrained environments. The device's form factor and electrical characteristics support high-performance digital system development.

XC6SLX25-3FTG256I Quick Information

Product Type: Field Programmable Gate Array (FPGA)
Canonical Name: XC6SLX25-3FTG256I

XC6SLX25-3FTG256I Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XC6SLX25-3FTG256I Estimated Pricing

Qty Low High
1+ $21.20 $21.20

Estimated market price range - modelled values for guidance only, not live distributor offers.

XC6SLX25-3FTG256I Features

  • High I/O count with 186 pins
  • Operates from -40°C to 100°C
  • 256-FTBGA surface mount package
  • Contains 24,051 logic elements
  • Voltage range 1.14V to 1.26V

XC6SLX25-3FTG256I Applications

  • Suitable for embedded digital systems
  • Used in signal processing applications
  • Ideal for high-density logic designs
  • Applicable in communications equipment

XC6SLX25-3FTG256I FAQs

4 frequently asked questions generated from this part’s specifications.
What is the number of I/O pins on this FPGA?

The FPGA has 186 I/O pins.

What is the operating temperature range?

-40°C to 100°C.

What package type does this FPGA use?

256-FTBGA (17x17).

What is the voltage range for this FPGA?

1.14V to 1.26V.

XC6SLX25-3FTG256I Alternate Parts

Same form/fit/function or matching attribute configuration across different manufacturers.
View All Alternate Parts
XC6SLX25-2FTG256I
XC6SLX25-2FTG256I
Advanced Micro Devices
The Advanced Micro Devices XC6SLX25-2FTG256I is an FPGA with 186 I/O and 24051 logic elements. It operates within a temperature range of -40°C to 100°C.
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