| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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2,782 pcs
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2782 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XC6SLX25-3FTG256I is an FPGA device manufactured by Advanced Micro Devices. It features 186 input/output pins and is housed in a 256-FTBGA package measuring 17x17 mm. This FPGA is suitable for embedded system designs requiring high I/O count and flexible programmable logic. Its package mounting type is surface mount, compatible with standard PCB assembly processes.
The device's specifications include a wide operating temperature range from -40°C to 100°C and an operating voltage between 1.14V and 1.26V. It contains 24,051 logic elements, 958,464 total RAM bits, and 1,879 logic array blocks. These features make it suitable for complex digital logic applications, including signal processing, communications, and control systems.
Designed for embedded applications, this FPGA supports high-density logic implementation and multiple I/O configurations. Its surface-mount package facilitates reliable mounting on printed circuit boards, making it ideal for space-constrained environments. The device's form factor and electrical characteristics support high-performance digital system development.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The FPGA has 186 I/O pins.
-40°C to 100°C.
256-FTBGA (17x17).
1.14V to 1.26V.