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XC6SLX25-3FGG484I The XC6SLX25-3FGG484I is an FPGA device featuring 24051 logic elements, 1879 logic array blocks, and 266 I/O pins, housed in a 484-BBGA package.
Mfr Part #:

XC6SLX25-3FGG484I

Available from 1 distributors
Mfr Name: Advanced Micro Devices
Advanced Micro Devices
The XC6SLX25-3FGG484I is an FPGA device featuring 24051 logic elements, 1879 logic array blocks, and 266 I/O pins, housed in a 484-BBGA package.
Total Stock: 1,247 pcs
$ Price Range: $21.20

XC6SLX25-3FGG484I Available from 1 distributor

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Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
1,247 pcs
1247 pcs On Request 1 On Request On Request On Request On Request On Request

XC6SLX25-3FGG484I Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Supplier Package
Total RAM Bits
Voltage

XC6SLX25-3FGG484I Description

Short technical summary and product information.

The XC6SLX25-3FGG484I is a field programmable gate array (FPGA) manufactured by Advanced Micro Devices. It contains 24051 logic elements and 1879 logic array blocks, suitable for complex digital logic applications. The device supports a total of 958464 RAM bits and has 266 input/output pins, making it suitable for high-density digital designs.

 

This FPGA is packaged in a 484-BBGA (484-FBGA) surface-mount package measuring 23x23 mm. It is designed for embedded systems requiring high logic density and I/O flexibility. The device operates within a voltage range of 1.14V to 1.26V and can withstand operating temperatures from -40°C to 100°C.

 

Applications include digital signal processing, communications, and embedded control systems where high logic capacity and I/O count are critical. The package supports surface mounting on printed circuit boards, suitable for compact and high-performance electronic designs.

XC6SLX25-3FGG484I Quick Information

Product Type: Field Programmable Gate Array (FPGA)
Canonical Name: XC6SLX25-3FGG484I

XC6SLX25-3FGG484I Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XC6SLX25-3FGG484I Estimated Pricing

Qty Low High
1+ $21.20 $21.20

Estimated market price range - modelled values for guidance only, not live distributor offers.

XC6SLX25-3FGG484I Features

  • High logic element count of 24051
  • 266 I/O pins for flexible connectivity
  • Operates at 1.14V to 1.26V
  • 484-BBGA surface mount package
  • Supports operating temperature from -40°C to 100°C

XC6SLX25-3FGG484I Applications

  • Ideal for complex digital logic designs
  • Used in embedded system development
  • Suitable for high-speed digital applications
  • Applicable in communication systems

XC6SLX25-3FGG484I FAQs

5 frequently asked questions generated from this part’s specifications.
How many logic elements does the XC6SLX25-3FGG484I have?

The device contains 24051 logic elements.

What is the package type of the XC6SLX25-3FGG484I?

It is housed in a 484-BBGA package.

What is the operating voltage range for the XC6SLX25-3FGG484I?

The device operates at 1.14V to 1.26V.

How many I/O pins are available on this FPGA?

It has 266 I/O pins.

What is the maximum operating temperature for the XC6SLX25-3FGG484I?

The maximum operating temperature is 100°C.

XC6SLX25-3FGG484I Alternate Parts

Same form/fit/function or matching attribute configuration across different manufacturers.
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XC6SLX25-2FG484I
XC6SLX25-2FG484I
Advanced Micro Devices
The XC6SLX25-2FG484I is an FPGA with 24051 logic elements, 266 I/O pins, and a 484FBGA package, suitable for embedded applications.
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