| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,524 pcs
|
2524 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
458 pcs
|
458 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Data Rate | |
| Lead Spacing | |
| Mounting Style | |
| Mounting Type | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Supply Voltage | |
| Total RAM Bits | |
| Voltage |
The XC6SLX150T-3FGG676I is a Field Programmable Gate Array (FPGA) manufactured by AMD. This component features 147,443 logic elements and 23,038 Adaptive Logic Modules (ALMs), providing significant processing capability.
It offers 396 input/output (I/O) pins and includes 4.71 Mbit of embedded memory. The device operates within a supply voltage range of 1.14V to 1.26V and has a data rate of 3.2 Gb/s. It also contains 8 transceivers for high-speed communication.
The operating temperature range for this FPGA is -40°C to +100°C. It is supplied in a 676-FBGA (27x27) package, designed for surface mount (SMD/SMT) applications. The package code is BGA-676.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
147,443 logic elements.
396 I/O pins.
3.2 Gb/s.
BGA-676.
-40°C to +100°C.
1.14 V to 1.26 V.