| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,219 pcs
|
2219 pcs | On Request | 1 | On Request | On Request | 24+ | On Request | On Request | |
|
1,120 pcs
|
1120 pcs | On Request | 1 | On Request | On Request | 21+ | On Request | On Request | |
|
1,080 pcs
|
1080 pcs | On Request | 1 | On Request | On Request | 21+ | On Request | On Request | |
|
5 pcs
|
5 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Military Grade | |
| Operating Temperature | |
| Storage Temperature | |
| Tape & Reel |
The XC6SLX100-2CSG484I is a field-programmable gate array (FPGA) manufactured by Xilinx. It contains 101,261 logic elements and is housed in a 484-ball fine ball grid array (FBGA) package. Designed for applications requiring high logic density, it operates within a temperature range of -40°C to +85°C and is RoHS3 compliant. The FPGA is suitable for embedded systems, digital signal processing, and complex logic implementation.
This FPGA features a compact package suitable for space-constrained designs and offers high performance for various digital applications. It is used in telecommunications, industrial automation, and aerospace systems where reliable high-density logic is essential. The device's package and pin configuration facilitate surface-mount assembly, making it compatible with standard PCB manufacturing processes.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.72 | $4.72 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is -40°C to +85°C.
Yes, it is RoHS3 compliant.
It uses a 484-FBGA package.