| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,100 pcs
|
2100 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
670 pcs
|
670 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| Number of Gates | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Tape & Reel | |
| Total RAM Bits | |
| Voltage |
The Advanced Micro Devices XC3S700AN-4FGG484C is a Field Programmable Gate Array (FPGA) designed for embedded applications. It features 372 I/O pins and 13248 logic elements, with a total of 700000 gates and 368640 RAM bits.
This FPGA operates within a voltage range of 1.14V to 1.26V and has an operating temperature range of 0°C to 85°C (TJ). It is housed in a 484-FBGA (23x23) package and utilizes a surface mount type.
The XC3S700AN-4FGG484C is suitable for various digital logic and processing tasks where reconfigurability is required. Its specifications make it a viable option for designs needing a moderate number of logic elements and I/O capabilities.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is 0°C to 85°C (TJ).
The voltage range is 1.14V to 1.26V.
It has 372 I/O pins.
The total RAM bits are 368640.
There are 13248 logic elements.
It is a 484-FBGA (23x23) package and uses surface mount type.