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XC3S500E-4FTG256I The XC3S500E-4FTG256I is an FPGA with 10,476 logic elements and 190 I/O pins, packaged in a 256-LBGA surface-mount package.
Mfr Part #:

XC3S500E-4FTG256I

Available from 2 distributors
Mfr Name: Advanced Micro Devices
Advanced Micro Devices
The XC3S500E-4FTG256I is an FPGA with 10,476 logic elements and 190 I/O pins, packaged in a 256-LBGA surface-mount package.
✓ Total Stock: 3,122 pcs
$ Price Range: $21.20

XC3S500E-4FTG256I Available from 2 distributors

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Romaks Technologies ✓
Non-Authorised Inventory information
3,117 pcs
On Request
3117 pcs On Request 1 On Request On Request On Request On Request On Request
Innova Technologies ✓
Non-Authorised Inventory information
5 pcs
On Request
5 pcs On Request 1 On Request On Request 20+ On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

XC3S500E-4FTG256I Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of Gates
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Tape & Reel
Total RAM Bits
Voltage
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XC3S500E-4FTG256I Description

Short technical summary and product information.

The XC3S500E-4FTG256I is a field programmable gate array (FPGA) manufactured by Advanced Micro Devices. It contains 10,476 logic elements, 500,000 gates, and a total of 368,640 RAM bits. The device features 190 input/output pins and is housed in a 256-LBGA package with a 256-FTBGA (17x17) footprint, suitable for surface mounting.

 

This FPGA is designed for embedded applications requiring high logic density and I/O capacity. Its operating voltage ranges from 1.14V to 1.26V, and it operates within a temperature range of -40°C to 100°C. The device's configuration makes it suitable for complex digital logic, signal processing, and control systems.

 

The package is intended for surface mount assembly, providing a compact form factor for integration into various electronic systems. Its high logic element count and I/O count support complex designs and high-speed data processing tasks.

XC3S500E-4FTG256I Quick Information

Product Type: Field Programmable Gate Array
Canonical Name: XC3S500E-4FTG256I

XC3S500E-4FTG256I Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XC3S500E-4FTG256I Estimated Pricing

Qty Low High
1+ $21.20 $21.20

Estimated market price range - modelled values for guidance only, not live distributor offers.

XC3S500E-4FTG256I Features

  • Contains 10,476 logic elements
  • Supports 190 I/O pins
  • Operates at 1.14V to 1.26V
  • Housed in 256-LBGA package
  • Operates from -40°C to 100°C

XC3S500E-4FTG256I Applications

  • Ideal for embedded digital logic systems
  • Suitable for high-density FPGA designs
  • Used in signal processing applications
  • Supports complex control systems

XC3S500E-4FTG256I FAQs

5 frequently asked questions generated from this part’s specifications.
How many logic elements does the XC3S500E-4FTG256I contain?

The XC3S500E-4FTG256I contains 10,476 logic elements.

What is the operating voltage range of the XC3S500E-4FTG256I?

The operating voltage range is from 1.14V to 1.26V.

How many I/O pins are available on this FPGA?

The device has 190 I/O pins.

What package type is used for the XC3S500E-4FTG256I?

It is packaged in a 256-LBGA package with a 256-FTBGA (17x17) footprint.

What is the operating temperature range of this FPGA?

It operates within a temperature range of -40°C to 100°C.

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