| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
6,696 pcs
|
6696 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
1,800 pcs
|
1800 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Spacing | |
| Mounting Type | |
| Number of Gates | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Total RAM Bits | |
| Voltage |
The Advanced Micro Devices XC3S400AN-5FGG400C is an FPGA with a surface mount package. It features 8064 logic elements and 896 LABs, providing a capacity of 400,000 gates. The device offers 311 I/O pins and 368,640 total RAM bits.
This FPGA operates within a voltage range of 1.14V to 1.26V and has an operating temperature range of 0°C to 85°C (TJ). The package is a 400-FBGA (21x21), also referred to as a 400-BGA.
Designed for embedded applications, this FPGA is suitable for various digital logic and processing tasks. Its specifications make it a versatile component for custom hardware acceleration and system-on-chip designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating voltage is 1.14V to 1.26V.
It has 8064 logic elements.
The package is 400-FBGA (21x21).
The operating temperature is 0°C to 85°C (TJ).
It features 311 I/O pins.