XC3S400-4FTG256I The AMD XC3S400-4FTG256I is a Spartan-3 series FPGA with 8064 logic cells and 173 I/O pins. It operates at a supply voltage of 1.14V to 1.26V and has a maximum clock frequency of 200 MHz.
Mfr Part #:

XC3S400-4FTG256I

Available from 1 distributors
Mfr Name: Xilinx
Xilinx
The AMD XC3S400-4FTG256I is a Spartan-3 series FPGA with 8064 logic cells and 173 I/O pins. It operates at a supply voltage of 1.14V to 1.26V and has a maximum clock frequency of 200 MHz.
Total Stock: 2,060 pcs

XC3S400-4FTG256I Available from 1 distributor

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XC3S400-4FTG256I Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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XC3S400-4FTG256I Description

Short technical summary and product information.

The XC3S400-4FTG256I is an FPGA from AMD's Spartan-3 family, formerly developed by Xilinx. This device features 8064 logic elements and 896 logic array blocks (LABs/CLBs), providing a logic density equivalent to 400,000 gates. It offers 173 I/O pins for interfacing with other components.

 

Designed for a supply voltage range of 1.14V to 1.26V, the XC3S400-4FTG256I supports a maximum clock frequency of up to 200 MHz. Its operating temperature range is -40°C to 100°C (TJ). The FPGA includes 294,912 total RAM bits for data storage.

 

This component is housed in a 256-FTBGA (17x17) package and is designed for surface mounting. The typical dynamic power consumption is around 1.5W, though this can vary based on logic density and clock speed. It is RoHS3 compliant and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours).

XC3S400-4FTG256I Quick Information

Product Type: FPGA
Series: Spartan-3
Canonical Name: XC3S400-4FTG256I FPGA
Subcategory: Embedded FPGAs

XC3S400-4FTG256I Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XC3S400-4FTG256I Features

  • Spartan-3 FPGA with 400,000 gates.
  • Features 8064 logic elements and 896 CLBs.
  • Provides 173 I/O pins for connectivity.
  • Operates at up to 200 MHz clock frequency.
  • Surface mount 256-FTBGA package.

XC3S400-4FTG256I Applications

  • Embedded digital logic and control systems.
  • Communications interface and protocol bridging.
  • Industrial automation and motor control.
  • Video and image processing pipelines.
  • Prototyping and ASIC emulation platforms.

XC3S400-4FTG256I FAQs

6 frequently asked questions generated from this part’s specifications.
What is the maximum clock frequency for the XC3S400-4FTG256I?

The XC3S400-4FTG256I operates with a maximum clock frequency of up to 200 MHz.

What is the typical dynamic power consumption of the XC3S400-4FTG256I?

The typical dynamic power consumption for the XC3S400-4FTG256I is around 1.5W.

What is the operating temperature range for the XC3S400-4FTG256I?

The operating temperature range for the XC3S400-4FTG256I is -40°C to 100°C (TJ).

What is the supply voltage for the XC3S400-4FTG256I?

The supply voltage for the XC3S400-4FTG256I ranges from 1.14V to 1.26V.

How many logic elements does the XC3S400-4FTG256I have?

The XC3S400-4FTG256I has 8064 logic elements/cells.

What package type is the XC3S400-4FTG256I supplied in?

The XC3S400-4FTG256I is supplied in a 256-FTBGA package.

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