| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
4,018 pcs
|
4018 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
2,620 pcs
|
2620 pcs | On Request | 1 | On Request | On Request | 17+ | On Request | On Request | |
|
168 pcs
|
168 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
86 pcs
|
86 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
15 pcs
|
15 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The XC3S250E-4FTG256C is a Field Programmable Gate Array (FPGA) manufactured by AMD. This IC features 172 I/Os and is packaged in a 256-pin Fine Pitch Ball Grid Array (FTBGA), suitable for surface mount applications.
Key technical specifications include 250,000 gates, 5,508 logic elements/cells, and 612 LABs/CLBs, providing significant computational capacity and flexibility. It offers 221,184 bits of RAM for complex data storage and processing. The operating temperature range is 0°C to 85°C (TJ), ensuring reliable performance.
This FPGA is designed for applications requiring high flexibility and configurability, such as telecommunications, industrial control, consumer electronics, automotive systems, medical devices, and aerospace and defense.
Development is supported by AMD's Xilinx ISE Design Suite and SDK, along with reference designs and evaluation kits.
| Qty | Low | High |
|---|---|---|
| 1+ | $22.15 | $22.15 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
5,508 logic elements.
221,184 bits of block RAM.
172 I/O pins.
1.14V to 1.26V.
250,000 system gates.
256-FTBGA (Fine-pitch Thin Ball Grid Array).