| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,500 pcs
|
2500 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Number of Gates | |
| Number of I | |
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| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Tape & Reel | |
| Total RAM Bits | |
| Voltage |
This Advanced Micro Devices XC3S200AN-4FTG256C is a Field Programmable Gate Array (FPGA) designed for embedded applications. It offers 4032 logic elements and 448 LABs, with a total of 294912 RAM bits and approximately 200,000 gates.
The device provides 195 I/O pins and operates at a voltage range of 1.14V to 1.26V. The operating temperature is specified from 0°C to 85°C (TJ). It is supplied in a 256-FTBGA (17x17) package, with a mounting type of Surface Mount.
Key specifications include a logic element count of 4032 and 195 I/O pins. The FPGA is designed for moderate complexity tasks requiring flexible logic implementation. Its operating conditions make it suitable for various industrial and commercial environments.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.20 | $21.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The XC3S200AN-4FTG256C has 4032 logic elements.
The operating temperature range for the XC3S200AN-4FTG256C is 0°C to 85°C (TJ).
This FPGA operates at a voltage between 1.14V and 1.26V.
The XC3S200AN-4FTG256C is supplied in a 256-LBGA package.
The XC3S200AN-4FTG256C offers 195 I/O pins.