| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
650 pcs
|
650 pcs | On Request | 1 | On Request | On Request | 13+15+ | On Request | On Request | |
|
25 pcs
|
25 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
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| Tape & Reel |
The Xilinx XC3S1500-4FGG676I is a high-capacity, cost-optimized Field Programmable Gate Array (FPGA) from the Spartan-3 series. This device is engineered for applications requiring high logic density, extensive I/O, and reliable performance within an industrial temperature range.
Key technical specifications include 29,952 logic cells and 1.5 million system gates, providing ample resources for complex digital designs. It offers 487 user I/O pins and 72 Kbits of fast Block RAM for on-chip data storage. The operating core supply voltage is typically 1.2V (1.14V to 1.26V), with I/O voltages supporting 2.5V and 3.3V.
Designed for industrial applications, the XC3S1500-4FGG676I is fully specified for operation from -40°C to +100°C (TJ). It comes in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with a 1mm ball pitch, suitable for surface mounting.
This FPGA is RoHS3 compliant and available with a factory lead time of 10 weeks. Its active lifecycle status indicates it is in production and readily available.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.72 | $4.72 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The core operating supply voltage is typically 1.2V, ranging from 1.14V to 1.26V.
This FPGA operates in an industrial temperature range from -40°C to +100°C (TJ).
The XC3S1500-4FGG676I is supplied in a 676-BGA package.
Yes, the device is RoHS3 Compliant.