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XC17S30APD8C The Xilinx XC17S30APD8C is a Configuration PROM with 300kb memory size and OTP programmable type. It is designed for through-hole mounting in an 8-DIP package.
Mfr Part #:

XC17S30APD8C

Available from 2 distributors
Mfr Name: Xilinx
Xilinx
The Xilinx XC17S30APD8C is a Configuration PROM with 300kb memory size and OTP programmable type. It is designed for through-hole mounting in an 8-DIP package.
✓ Total Stock: 193 pcs
$ Price Range: $4.72

XC17S30APD8C Available from 2 distributors

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Smaxon Electronics ✓
Non-Authorised Inventory information
100 pcs
On Request
100 pcs On Request 1 On Request On Request 17+ On Request On Request
Fe Components ✓
Non-Authorised Inventory information
93 pcs
On Request
93 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

XC17S30APD8C Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Memory Size
Mounting Type
Operating Temperature
Programmable Type
Supplier Device Package
Voltage Supply
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XC17S30APD8C Description

Short technical summary and product information.

The Xilinx XC17S30APD8C is a Configuration PROM designed for embedded applications. It features a memory size of 300kb and is One-Time Programmable (OTP).

 

This component operates within a supply voltage range of 3V to 3.6V and has an operating temperature range of 0°C to 70°C. The XC17S30APD8C is packaged in an 8-DIP (0.300", 7.62mm) format and is designed for through-hole mounting.

 

As a configuration PROM, this part is typically used to store configuration data for FPGAs or other programmable logic devices, enabling them to initialize with specific settings upon power-up.

XC17S30APD8C Quick Information

Product Type: Configuration PROM
Canonical Name: Xilinx XC17S30APD8C Configuration PROM
Subcategory: Embedded

XC17S30APD8C Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

XC17S30APD8C Estimated Pricing

Qty Low High
1+ $4.72 $4.72

Estimated market price range - modelled values for guidance only, not live distributor offers.

XC17S30APD8C Features

  • 300kb OTP configuration memory
  • Operates at 3V to 3.6V supply voltage
  • Package type is 8-DIP through hole
  • Temperature range from 0°C to 70°C
  • Designed for FPGA configuration

XC17S30APD8C Applications

  • Used for FPGA configuration storage
  • Suitable for embedded system applications
  • Ideal for non-volatile memory needs
  • Mounts in through-hole PCB designs

XC17S30APD8C FAQs

6 frequently asked questions generated from this part’s specifications.
What is the memory size of the XC17S30APD8C?

The memory size is 300kb.

What type of programming does the XC17S30APD8C support?

It supports OTP (One-Time Programmable) type.

What is the operating temperature range for the XC17S30APD8C?

The operating temperature range is 0°C to 70°C.

What is the supply voltage range for this component?

The supply voltage range is 3V to 3.6V.

What package is the XC17S30APD8C supplied in?

It is supplied in an 8-DIP (0.300", 7.62mm) package.

How is the XC17S30APD8C mounted?

It is designed for through-hole mounting.

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