| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
526 pcs
|
526 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name |
The WIN777M6FBC-166B1 is a MOSFET manufactured by Microsemi Corporation. This component is categorized under Transistors - FETs, MOSFETs - Single.
Key specifications include RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1 Unlimited. The part is described with a package code of 867.
This component is suitable for various electronic applications requiring MOSFET functionality. Its compliance with RoHS3 standards indicates adherence to environmental regulations regarding hazardous substances.
Further technical details such as operating voltage, current ratings, and specific package dimensions would typically be found in the manufacturer's datasheet.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.27 | $2.27 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The WIN777M6FBC-166B1 is RoHS3 Compliant.
The MSL for the WIN777M6FBC-166B1 is Level 1.
The package code is 867.