| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
212 pcs
|
212 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Military Grade | |
| Storage Temperature | |
| Tape & Reel |
The WCD-9330-0-119BWLNSP-TR-01-0 from Qualcomm is a specialized integrated circuit designed for various electronic applications. This component is supplied in a BGA package, indicating a surface-mount form factor suitable for automated assembly processes.
Key specifications include RoHS3 compliance, signifying adherence to environmental regulations regarding hazardous substances. It also carries a Moisture Sensitivity Level (MSL) of 1, meaning it has unlimited shelf life under recommended storage conditions and does not require special handling to prevent moisture absorption before soldering.
This part is categorized under Specialized ICs within the broader Discrete Semiconductor Products group. Its specific function and electrical characteristics would typically be detailed in a datasheet, which is not currently available. The BGA packaging suggests it is intended for high-density board designs where space is a premium.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.94 | $1.94 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The RoHS status is RoHS3 Compliant.
The MSL rating is 1 Unlimited.
It is supplied in a BGA package.