| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,340 pcs
|
2340 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Access Time | |
| Clock Frequency | |
| Memory Format | |
| Memory Interface | |
| Memory Organization | |
| Memory Size | |
| Memory Type | |
| Mounting Type | |
| Operating Temperature | |
| Supplier Device Package | |
| Technology | |
| Voltage | |
| Write Cycle Time |
The Winbond W989D6DBGX6I is a high-performance 512Mbit DRAM memory integrated circuit designed for mobile applications. It utilizes Mobile LPSDR SDRAM technology, offering efficient data transfer with a clock frequency of 166 MHz and a fast access time of 5 ns.
This memory IC operates within a voltage range of 1.7V to 1.95V, making it suitable for power-sensitive designs. The memory organization is 32M x 16, providing ample capacity for various embedded systems. It supports parallel memory interface and is classified as volatile memory.
The W989D6DBGX6I comes in a compact 54-TFBGA package, specifically a 54-VFBGA (8x9) variant, designed for surface mounting. This form factor is ideal for space-constrained applications where efficient board layout is crucial. The operating temperature range is -40°C to 85°C (TA), ensuring reliable performance in diverse environmental conditions.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
1.7V to 1.95V.
54-TFBGA (54-VFBGA 8x9).
-40°C to 85°C.
512 Mbit.
166 MHz.
32M x 16.
5 ns.