| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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234 pcs
|
234 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
234 pcs
|
234 pcs | On Request | 1 | On Request | On Request | 1743+ | On Request | On Request | |
|
1 pcs
|
1 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Winbond W632GG6MB-12 is a high-performance 2 Gbit DDR3 SDRAM component designed for various embedded applications. It features a parallel memory interface and a memory organization of 128M x 16.
This device operates at a clock frequency of 800 MHz with an access time of 20 ns. The operating voltage range is 1.425V to 1.575V, making it suitable for power-conscious designs. The component is specified for operation within a temperature range of 0°C to 95°C (TC).
Packaged in a 96-VFBGA (7.5x13) format, the W632GG6MB-12 is designed for surface mount applications. Its volatile memory type and DDR3 technology ensure efficient data handling for demanding tasks in industrial, communication, and consumer electronics.
Key specifications include a 2 Gbit memory size, 128M x 16 organization, and 800 MHz clock speed. The component is built on SDRAM - DDR3 technology, offering a balance of speed and density for modern embedded systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The memory size is 2 Gbit.
It is a Volatile memory.
The memory interface is Parallel.
The memory format is DRAM.
The memory organization is 128M x 16.
It uses SDRAM - DDR3 technology.
The clock frequency is 800 MHz.
The access time is 20 ns.
The operating voltage is between 1.425V and 1.575V.
The operating temperature is from 0°C to 95°C (TC).
The mounting type is Surface Mount.
The package is 96-VFBGA.
The supplier package is 96-VFBGA (7.5x13).