| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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130 pcs
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130 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The W25Q128BVEG, manufactured by Winbond Electronics, is a memory component designed for various electronic applications. This part is compliant with RoHS3 standards and has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited shelf life under recommended storage conditions. It comes in a QFN package, suitable for surface-mount assembly.
This memory component is part of the broader category of integrated circuits, specifically within the memory sub-sector. Its specifications, including RoHS3 compliance and MSL 1 rating, make it a reliable choice for designs where environmental standards and component longevity are critical. The QFN packaging facilitates integration into compact electronic devices.
Further technical details, such as operating voltage, temperature range, and specific memory capacity or interface type, would typically be found in the manufacturer's datasheet. However, based on the available information, the W25Q128BVEG is identified as a memory IC with key compliance attributes.
Applications for this component can span various industries requiring reliable memory solutions. Its compliance and packaging type suggest suitability for both consumer and industrial electronics where space and environmental considerations are important.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The W25Q128BVEG is RoHS3 Compliant.
The MSL for the W25Q128BVEG is Level 1.
The W25Q128BVEG is available in a QFN package.