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4,000 pcs
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4000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The VSC7323XVH, also known as Meigs-IIe, is a high-density Gigabit Ethernet (GbE) and 10 GbE MAC chip from Microchip Technology. It is designed for enterprise, metro, and core network applications.
This chip integrates ten triple-speed MACs with SerDes, a single 10 Gigabit Ethernet MAC with XAUI, an OIF-compliant SPI-4.2 interface, and a configurable parallel/serial CPU interface. It also includes dual MII Management interfaces. The VSC7323XVH supports MII for 10/100 Ethernet and RGMII/GMII for GbE. The 10 GbE MAC is IEEE 802.3ae-compliant and handles frame transmission and reception details.
Connectivity to 10 Gbps optical modules is facilitated through the integrated XAUI compliant serial interface. The device features internal ingress (Rx) and egress (Tx) FIFOs, provisionable in 2 kB increments per port, supporting cut-through or store-and-forward modes. The SPI-4.2 interface allows seamless data transfer with network processors and other devices.
The VSC7323XVH is implemented in 0.18 micron CMOS technology and operates with 2.5V/3.3V IO. It is specified for an industrial temperature range of -40°C to +85°C and comes packaged in a 728-pin TBGA.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.20 | $1.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The VSC7323XVH integrates ten triple-speed MACs, including ten 1G and 10G Ethernet MACs, and a single 10 Gigabit Ethernet MAC with an integrated XAUI interface.
The VSC7323XVH operates within an industrial temperature range of -40°C to +85°C.
The VSC7323XVH is supplied in a 728-pin TBGA package.
The VSC7323XVH supports 2.5V and 3.3V IO.