| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
569 pcs
|
569 pcs | On Request | 1 | On Request | On Request | 04+ | On Request | On Request |
| Category | |
| Manufacturer Name |
The UPD16306BGF-3BA is an integrated circuit manufactured by NEC, supplied in a QFP package. This component is noted as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for a wide range of environmental conditions.
Further technical specifications such as operating voltage and temperature are not detailed in the available information and would typically be found in the manufacturer's datasheet. The QFP package suggests surface-mount capabilities, making it suitable for automated assembly processes.
This part is listed under the 'New Products' category, indicating it may be a recent addition to the market or a component of interest for new designs. For detailed application information or specific electrical characteristics, consulting the official NEC documentation is recommended.
The UPD16306BGF-3BA is supplied in a QFP package.
The UPD16306BGF-3BA is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the UPD16306BGF-3BA is 1 Unlimited.
The REACH status for the UPD16306BGF-3BA is Unaffected.