| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
9,799 pcs
|
9799 pcs | On Request | 1 | On Request | On Request | 21+ | On Request | On Request | |
|
3,000 pcs
|
3000 pcs | On Request | 1 | On Request | On Request | 21+ | On Request | On Request | |
|
1,628 pcs
|
1628 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Applications | |
| Interface | |
| Lead Spacing | |
| Mounting Type | |
| Supplier Device Package | |
| Supplier Package | |
| Voltage |
The UJA1169TK/3Z from NXP Semiconductors is a mini high-speed CAN System Basis Chip (SBC). It integrates an ISO 11898-2:201x compliant HS-CAN transceiver, supporting CAN FD active communication up to 2 Mbit/s in the data field. The chip includes an integrated 5 V or 3.3 V 250 mA scalable supply (V1) for microcontrollers and other loads, along with a watchdog and SPI interface.
This SBC can operate in very low-current Standby and Sleep modes, offering bus and local wake-up capabilities. The UJA1169TK/3Z variant features a 3.3 V regulator for V1. It implements the standard CAN physical layer as defined in ISO11898 standards, with additional parameters for loop delay symmetry to enable reliable communication at higher data rates.
The component is available in a 20-HVSON (3.5x5.5) package, suitable for surface mounting. It is designed for applications requiring a System Basis Chip with CAN interface capabilities.
| Qty | Low | High |
|---|---|---|
| 1+ | $6.39 | $6.39 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The UJA1169TK/3Z features an integrated 5 V or 3.3 V 250 mA scalable supply (V1).
The HS-CAN transceiver is compliant with ISO 11898-2:201x.
The UJA1169TK/3Z supports CAN FD active communication up to 2 Mbit/s in the data field.
It offers both bus and local wake-up capability.
The UJA1169TK/3Z is supplied in a 20-VFDFN Exposed Pad package and is suitable for Surface Mount.