| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
54,000 pcs
|
54000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
20,000 pcs
|
20000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | 2026-02-16 21:33:16 | |
|
3,314 pcs
|
3314 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
1,440 pcs
|
1440 pcs | On Request | 1 | On Request | On Request | 20+ | On Request | On Request |
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| Manufacturer Name | |
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| Interface | |
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The UJA1169ATK/F/3Z from NXP Semiconductors is a specialized integrated circuit functioning as a System Basis Chip. It is designed to support CAN and SPI communication interfaces, making it suitable for various embedded systems.
This component operates with a wide supply voltage range, from 3V to 28V. It features a surface mount package, specifically a 20-VFDFN Exposed Pad, with the supplier device package identified as 20-HVSON (3.5x5.5).
The UJA1169ATK/F/3Z is categorized under specialized interface ICs. Its primary application is as a System Basis Chip, facilitating communication protocols like CAN and SPI in automotive and industrial applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $6.39 | $6.39 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating voltage range is 3V to 28V.
It uses a 20-VFDFN exposed pad package with a 20-HVSON (3.5x5.5) footprint.
It supports CAN and SPI interfaces.
It is RoHS3 compliant, although this status is unverified.