SL3S1206FUD2/HAA-VB2
NXP Semiconductors
The NXP Semiconductors SL3S1206FUD2/HAA-VB2 is a Chassis Mount Resistor. It is RoHS3 Compliant and REACH Unaffected.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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113 pcs
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113 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
| Tape & Reel |
This Samtec Inc. TSW11309GT is a male pin header designed for board-to-board or cable applications. It features 39 positions arranged in 3 rows with a mating pitch of 0.100" (2.54mm). The header is designed for through-hole mounting and utilizes solder termination.
The contact length for mating is 0.230" (5.84mm), and the post contact length is 0.400". The series is TSW, and the product status is active. This component is suitable for various electronic assemblies requiring reliable interconnectivity.
Key specifications include a 0.100" row spacing and a push-pull fastening type. The RoHS status is reported as RoHS3 Compliant, and the Moisture Sensitivity Level (MSL) is 1 Unlimited.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.43 | $0.43 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The TSW11309GT header has 39 positions.
The pitch of the TSW11309GT header is 0.100 inches (2.54mm).
The TSW11309GT header has 3 rows.
The row spacing for the TSW11309GT header is 0.100 inches (2.54mm).
The TSW11309GT header uses through hole mounting.
The termination style for the TSW11309GT header is solder.
The RoHS status is RoHS3 Compliant.