Mfr Part #:

TSM-113-01-L-DV-A-P

26 position, 2-row surface mount header with 2.54mm pitch. Male square pins with gold plating on mating surface and matte tin on tails.

✓ Total Stock: 104 pcs

$ Price Range: $1.96 - $3.29

TSM-113-01-L-DV-A-P Available from 1 distributor

✓ Authorised

✓ Non-Authorised

Distributor		Stock	Pricing	MOQ	PKG	Lead Time	Date Code	On Order Quantity	On Order Delivery
ADI/AAR OEM Supply ✓ Non-Authorised Inventory information	104 pcs On Request	104 pcs	On Request	1	On Request	On Request	On Request	On Request	On Request

TSM-113-01-L-DV-A-P Description

Short technical summary and product information.

The Samtec TSM-113-01-L-DV-A-P is a 26-position, 2-row surface mount header from the TSM series. It features a 2.54mm (0.100") pitch and row spacing, with male square pins made of phosphor bronze. The contact finish is 10µin gold on the mating post and matte tin on the solder tail, over 50µin nickel underplating.

This unshrouded header uses a push-pull fastening type and is designed for board-to-board or cable applications. The insulator is black liquid crystal polymer (LCP) rated UL94 V-0. It includes board guide and pick-and-place features for automated assembly.

The operating temperature range is -55°C to +125°C when mated with gold-plated counterparts. The part is lead-free solderable and RoHS compliant (unverified).

TSM-113-01-L-DV-A-P Quick Information

Product Type: Header, Male Pins

Series: TSM

Canonical Name: Samtec TSM-113-01-L-DV-A-P 26 Position 2.54mm Pitch Surface Mount Header, Male Pins

Subcategory: Male Pins

TSM-113-01-L-DV-A-P Compliance

RoHS Status: RoHS Compliant

Moisture Sensitivity Level (MSL): 1 Unlimited

REACH Status: REACH Unaffected

Lead Free: Yes

TSM-113-01-L-DV-A-P Estimated Pricing

Qty	Low	High
1+	$3.29	$3.29
17+	$3.07	$3.07
51+	$3.05	$3.05
510+	$2.40	$2.40
1,003+	$2.17	$2.17
2,516+	$1.96	$1.96

Estimated market price range - modelled values for guidance only, not live distributor offers.

TSM-113-01-L-DV-A-P Features

26 position 2-row surface mount header.
2.54mm pitch with 2.54mm row spacing.
Gold plated mating post, matte tin tail.
LCP insulator rated UL94 V-0.
Board guide and pick-and-place features.

TSM-113-01-L-DV-A-P Applications

Board-to-board interconnects in compact electronics.
Cable-to-board connections using IDSS/IDSD mates.
Automated assembly with pick-and-place capability.
Applications requiring -55°C to +125°C operation.

TSM-113-01-L-DV-A-P FAQs

6 frequently asked questions generated from this part’s specifications.

What is the pitch of the TSM-113-01-L-DV-A-P?

The pitch is 2.54mm (0.100").

How many positions does this header have?

It has 26 positions arranged in 2 rows.

What is the mounting type?

Surface mount (SMD) with solder termination.

What is the operating temperature range?

-55°C to +125°C when mated with gold-plated counterparts.

What is the contact finish?

10µin gold on the mating post and matte tin on the solder tail, over 50µin nickel.

Is this header shrouded?

No, it is unshrouded with a push-pull fastening type.

Category	Headers, Male Pins
Manufacturer Name	Samtec Inc.
Connector Type	Header
Contact Finish	Gold (post), Matte Tin (tail)
Contact Finish Thickness	10.0µin (0.25µm)
Contact Length	5.84mm (0.230")
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Features	Board Guide, Pick and Place
Insulation Color	Black
Insulation Height	2.54mm (0.100")
Insulation Material	Liquid Crystal Polymer (LCP)
Lead Spacing	2.54 mm
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	26
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature	-55°C ~ 125°C
Pitch	2.54mm (0.100")
Row Spacing	0.100" (2.54mm)
Shrouding	Unshrouded
Style	Board to Board or Cable
Tape & Reel	No
Termination	Solder