| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
160 pcs
|
160 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This TSM Series header from Samtec Inc. is a robust component designed for board-to-board or cable connections. It features 16 positions arranged in 2 rows, with a standard 2.54mm pitch and a 0.100" row spacing. The header is designed for surface mount right angle (SMD R/A) applications and terminates via solder.
Constructed with a Liquid Crystal Polymer (LCP) insulator in black and phosphor bronze terminals, this header is rated UL94 V-0 for material flammability. It operates reliably within a temperature range of -55°C to 125°C. The contact finish is tin with a thickness of 10µin (0.25µm), and the insulation height is 6.10mm.
Key features include board guide and pick and place capabilities, making it suitable for automated assembly processes. The header is designed to be unshrouded and utilizes a push-pull fastening type. It is lead-free solderable, aligning with modern manufacturing standards.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.77 | $0.77 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
16 positions.
2.54mm (0.100").
5.0 A per pin.
495 VAC.
Surface mount, right angle.
-55°C to 125°C.
Yes, it is lead-free solderable as per the datasheet.