| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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700 pcs
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700 pcs | On Request | 1 | On Request | On Request | 07+PB | On Request | On Request |
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| Manufacturer Name | |
| SVHC Present |
The TNETC4602ZDW is a specialized integrated circuit manufactured by Texas Instruments. This component is described as TI BGA, indicating its package type and manufacturer's designation. It adheres to RoHS3 compliance standards and has a Moisture Sensitivity Level (MSL) of 1, signifying unlimited usability under standard conditions. The REACH status is noted as unaffected. Further technical specifications, such as operating voltage and temperature, are not detailed in the provided information but would typically be found in the manufacturer's datasheet. This part is suitable for applications requiring specialized integrated circuit functionality within the Power Management PMIC category.
Packaging details for the TNETC4602ZDW are not fully specified in the available data. However, its classification as a TI BGA suggests a Ball Grid Array package, commonly used for surface-mount devices. Handling procedures for ESD-sensitive components are mentioned, with products sealed in ESD-safe packaging to prevent electrostatic damage. The product is available from YIC Electronics, with stock conditions and shipping information provided, including options via DHL, FedEx, TNT, and UPS from Hong Kong. Payment methods include PayPal, Credit Card, and Telegraphic Transfer.
The TNETC4602ZDW is RoHS3 Compliant.
The MSL for the TNETC4602ZDW is Level 1.
The REACH status is REACH Unaffected.