| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1 pcs
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1 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name |
The TMXF281553BAL-3C from Broadcom Limited is an integrated circuit designed for industrial automation and process automation applications. This component features a Ball Grid Array (BGA) package, providing a compact and robust solution for board mounting.
Key specifications include a pin count of 456, indicating a complex integrated circuit. The screening level is set to Industrial, suitable for demanding operational environments. The RoHS status is reported as RoHS3 Compliant, and the Moisture Sensitivity Level (MSL) is 1, signifying unlimited shelf life under proper storage conditions.
This part is manufactured by Broadcom Limited, a recognized supplier in the electronic components market. The BGA package type is ideal for surface-mount technology, enabling high-density circuit designs. Further technical details, such as operating voltage and specific functionalities, would typically be found in the product datasheet.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.16 | $1.16 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The TMXF281553BAL-3C uses a BGA package.
The TMXF281553BAL-3C has 456 pins.
The screening level for the TMXF281553BAL-3C is Industrial.
The TMXF281553BAL-3C is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the TMXF281553BAL-3C is 1 Unlimited.