| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,009 pcs
|
2009 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Clock Rate | |
| Industrial Grade | |
| Interface | |
| Lead Spacing | |
| Medical Grade | |
| Military Grade | |
| Mounting Type | |
| Non | |
| On | |
| Operating System | |
| Operating Temperature | |
| Supplier Device Package | |
| Type | |
| Voltage |
The Texas Instruments TMS320C6727BGDH300 is a high-performance Floating-Point Digital Signal Processor (DSP) operating at clock rates up to 300MHz. This device belongs to the C67x DSP generation and offers enhanced memory systems, including 256KB of unified Program/Data RAM and 384KB of unified Program/Data ROM. It also features a 32KB large program cache supporting RAM, ROM, and external memory.
The TMS320C6727BGDH300 includes an External Memory Interface (EMIF) supporting 133-MHz SDRAM and asynchronous NOR Flash, SRAM, and NAND Flash. Its enhanced I/O system comprises a high-performance crossbar switch, dedicated McASP DMA bus, and dMAX (Dual Data Movement Accelerator). Key interfaces include EBI/EMI, HPI, I²C, McASP, and SPI.
This DSP is available in a 256-BGA (17mm x 17mm) package and supports a surface mount type. The operating temperature range is specified from -40°C to 105°C (TC), with a typical operating voltage of 3.30V. Applications include professional audio mixers, effects boxes, audio synthesis, instrument/amp modeling, audio conferencing, and industrial systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $26.01 | $26.01 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The clock rate is 300MHz.
It is a Floating Point DSP.
It has 256KB of unified Program/Data RAM and 384KB of unified Program/Data ROM.
The operating temperature range is -40°C to 105°C (TC).
It is in a 256-BGA (17x17) package and is surface mountable.
Key interfaces include EBI/EMI, HPI, I²C, McASP, and SPI.