TLP700AF

The TLP700AF from Toshiba is a photocoupler designed for applications requiring high-speed, high-gain signal isolation. It is housed in a compact 6-pin SDIP package with leads bent to meet 8 mm PC board spacing requirements.

This photocoupler integrates a GaAℓAs infrared LED with a photodetector IC, providing a guaranteed common-mode transient immunity of ±20 kV/µs and an isolation voltage of 5000 Vrms. Key electrical specifications include an output peak current of up to ±2.5 A, a supply voltage range of 15 to 30 V, and a maximum supply current of 3 mA.

The TLP700AF is suitable for demanding applications such as transistor inverters, air conditioner inverters, and gate drivers for IGBT and power MOSFETs. It operates reliably across a wide temperature range of -40 to 110 °C. The device features a buffer logic type with a totem pole output.

Compliance with international safety standards is supported, including UL, cUL, and VDE approvals when the appropriate option is designated. The internal noise shield enhances performance in noisy environments. The 8 mm pitch lead spacing makes it a space-saving solution for safety-certified applications.