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3,000 pcs
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3000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | 2026-02-16 21:33:16 |
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The Infineon Technologies TLE9262BQXV33XUMA1 is a Mid-Range+ System Basis Chip (SBC) designed for automotive applications. It integrates two low-drop voltage regulators: a main regulator providing 3.3V up to 250mA and an auxiliary regulator offering 5V up to 100mA. Additionally, it includes a selectable 3.3V or 1.8V regulator configurable for various usage scenarios.
This SBC features a high-speed CAN transceiver supporting CAN FD communication up to 5 Mbit/s and a LIN transceiver compatible with LIN 2.2/ISO 17987-4/SAE J2602 standards. It also provides four high-side outputs, two High-Voltage GPIOs, and three High-Voltage wake inputs. Integrated fail-safe and supervision functions, including a watchdog and interrupt/reset outputs, enhance system reliability. Configuration and diagnostics are managed via a 16-bit SPI interface.
The TLE9262BQXV33XUMA1 is supplied in a 48-VFQFN exposed pad package and is surface-mounted. Its robust design and comprehensive feature set make it suitable for applications such as Body Control Modules, Gateway applications, HVAC systems, and various closure modules.
Product validation is according to AEC-Q100, confirming its suitability for demanding automotive environments.
| Qty | Low | High |
|---|---|---|
| 1+ | $6.39 | $6.39 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The TLE9262BQXV33XUMA1 features a main regulator with 3.3 V up to 250 mA and an auxiliary regulator with 5 V up to 100 mA.
It supports high-speed CAN FD communication up to 5 Mbit/s and LIN 2.2/ISO 17987-4/SAE J2602.
The TLE9262BQXV33XUMA1 is supplied in a 48-VFQFN Exposed Pad package.
Yes, the TLE9262BQXV33XUMA1 is qualified for automotive applications according to AEC-Q100.