| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,223 pcs
|
2223 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Memory Format | |
| Memory Interface | |
| Memory Organization | |
| Memory Size | |
| Memory Type | |
| Military Grade | |
| Mounting Type | |
| Operating Temperature | |
| SVHC Present | |
| Supplier Device Package | |
| Technology |
The THGBMJG7C1LBAIL is a high-density 128Gbit eMMC NAND flash memory IC manufactured by Kioxia America, Inc. It utilizes non-volatile FLASH technology organized as 16G x 8 bits, providing a compact and reliable storage solution for embedded applications. The memory interface is eMMC (Embedded MultiMediaCard), which simplifies integration by managing NAND flash complexities such as wear leveling and bad block management.
The device is housed in a 153-WFBGA (11.5x13) package designed for surface mount assembly. It operates over an industrial temperature range of -25°C to 85°C, making it suitable for a variety of environments. The 153-ball fine-pitch BGA package offers a small footprint, ideal for space-constrained designs.
This memory IC is well-suited for applications requiring high capacity and reliability, such as portable electronics, industrial control systems, and automotive infotainment. The eMMC interface provides a standardized solution that reduces design complexity and time to market.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The package is 153-WFBGA (11.5x13).
The operating temperature range is -25°C to 85°C (TA).