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THGAMRG7T13BAIL The Kioxia THGAMRG7T13BAIL is a 16GB e-MMC module featuring a JEDEC/MMCA Version 5.1 interface. It operates within a temperature range of -25°C to 85°C.
Mfr Part #:

THGAMRG7T13BAIL

Available from 1 distributors
Mfr Name: Toshiba
Toshiba
The Kioxia THGAMRG7T13BAIL is a 16GB e-MMC module featuring a JEDEC/MMCA Version 5.1 interface. It operates within a temperature range of -25°C to 85°C.
✓ Total Stock: 124 pcs
$ Price Range: $1.28

THGAMRG7T13BAIL Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
MW.FEP S.p.A. ✓
Non-Authorised Inventory information
124 pcs
On Request
124 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

THGAMRG7T13BAIL Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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Manufacturer Name
SVHC Present
Storage Temperature
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THGAMRG7T13BAIL Description

Short technical summary and product information.

The Kioxia THGAMRG7T13BAIL is a 16GB e-MMC module designed for embedded applications. It utilizes advanced NAND flash devices and a controller chip within a Multi Chip Module package.

 

This module features an industry-standard MMC protocol with a JEDEC / MMCA Version 5.1 interface, supporting 1-I/O, 4-I/O, and 8-I/O modes. It offers a typical read performance of 310 MB/s and a write performance of 110 MB/s under HS400 conditions with a 1.8V VCCQ.

 

The operating temperature range for this device is -25°C to 85°C, with a storage temperature range of -40°C to 85°C. The power supply requirements are VCC from 2.7V to 3.6V and VCCQ from 1.7V to 1.95V.

 

The THGAMRG7T13BAIL is housed in a P-WFBGA153-1113-0.50 package measuring 11.5mm x 13mm with a maximum height of 0.8mm. It is suitable for applications requiring reliable and high-density storage.

THGAMRG7T13BAIL Quick Information

Product Type: e-MMC Module
Canonical Name: 16GB e-MMC Module
Subcategory: e-MMC

THGAMRG7T13BAIL Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

THGAMRG7T13BAIL Estimated Pricing

Qty Low High
1+ $1.28 $1.28

Estimated market price range - modelled values for guidance only, not live distributor offers.

THGAMRG7T13BAIL Features

  • 16GB density e-MMC module.
  • JEDEC / MMCA Version 5.1 interface.
  • Operating temperature from -25°C to 85°C.
  • High performance with HS400 mode.
  • Compact 11.5mm x 13mm BGA package.

THGAMRG7T13BAIL Applications

  • Embedded systems storage.
  • Consumer electronics devices.
  • Industrial control systems.
  • Automotive applications.

THGAMRG7T13BAIL FAQs

6 frequently asked questions generated from this part’s specifications.
What is the storage capacity of the THGAMRG7T13BAIL?

The THGAMRG7T13BAIL has a storage capacity of 16GB.

What interface does the THGAMRG7T13BAIL use?

The THGAMRG7T13BAIL uses the JEDEC / MMCA Version 5.1 interface.

What is the operating temperature range for the THGAMRG7T13BAIL?

The operating temperature range for the THGAMRG7T13BAIL is -25°C to 85°C.

What are the typical read and write speeds for the THGAMRG7T13BAIL?

Under HS400 1.8V conditions, the THGAMRG7T13BAIL has a typical read speed of 310 MB/s and a typical write speed of 110 MB/s.

What are the power supply requirements for the THGAMRG7T13BAIL?

The power supply requirements are VCC from 2.7V to 3.6V and VCCQ from 1.7V to 1.95V.

What are the physical dimensions of the THGAMRG7T13BAIL package?

The THGAMRG7T13BAIL is housed in a P-WFBGA153-1113-0.50 package measuring 11.5mm x 13mm with a maximum height of 0.8mm.

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