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TDA18264HB/C1 The TDA18264HB/C1 is a Transceiver integrated circuit from NXP Semiconductors. It features a Surface Mount package and 16 circuits.
Mfr Part #:

TDA18264HB/C1

Available from 1 distributors
Mfr Name: NXP Semiconductors
NXP Semiconductors
The TDA18264HB/C1 is a Transceiver integrated circuit from NXP Semiconductors. It features a Surface Mount package and 16 circuits.
✓ Total Stock: 1,945 pcs
$ Price Range: $1.26

TDA18264HB/C1 Available from 1 distributor

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✓ Non-Authorised
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Flip Electronics ✓
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1,945 pcs
On Request
1945 pcs On Request 1 On Request On Request On Request On Request On Request
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TDA18264HB/C1 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Function
Mounting Type
Number of Circuits
Power (Watts)
Storage Temperature
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Tape & Reel
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TDA18264HB/C1 Description

Short technical summary and product information.

The NXP Semiconductors TDA18264HB/C1 is an integrated circuit designed for telecom applications. It functions as a transceiver and is suitable for surface mount assembly.

 

Key specifications include 16 circuits within the device and a power consumption of 2.55 Watts. The component is housed in an 80-TFQFN Exposed Pad package, with the supplier device package specified as 80-HTQFNR-EP (12x12).

 

This part is listed as obsolete. It is designed for surface mounting, requiring appropriate PCB soldering techniques for integration into electronic systems.

TDA18264HB/C1 Quick Information

Product Type: Integrated Circuit
Canonical Name: TDA18264HB/C1 Transceiver Integrated Circuit
Subcategory: Telecom IC

TDA18264HB/C1 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

TDA18264HB/C1 Estimated Pricing

Qty Low High
1+ $1.26 $1.26

Estimated market price range - modelled values for guidance only, not live distributor offers.

TDA18264HB/C1 Features

  • Transceiver function for telecom applications.
  • Surface mount design for easy PCB integration.
  • 16 circuits for versatile signal processing.
  • Power consumption of 2.55 W for efficient operation.
  • 80-TFQFN Exposed Pad package for thermal management.

TDA18264HB/C1 Applications

  • Used in telecom transceiver modules.
  • Suitable for surface-mount RF communication devices.
  • Ideal for multi-circuit RF signal processing.
  • Applicable in wireless communication systems.

TDA18264HB/C1 FAQs

7 frequently asked questions generated from this part’s specifications.
What is the function of the TDA18264HB/C1?

The function of the TDA18264HB/C1 is Transceiver.

How is the TDA18264HB/C1 mounted?

The TDA18264HB/C1 is mounted using the Surface Mount method.

What package type is the TDA18264HB/C1 supplied in?

The TDA18264HB/C1 is supplied in an 80-TFQFN Exposed Pad package.

What is the power consumption of the TDA18264HB/C1?

The power consumption of the TDA18264HB/C1 is 2.55 W.

What is the RoHS status of the TDA18264HB/C1?

The RoHS status of the TDA18264HB/C1 is RoHS3 Compliant.

What is the Moisture Sensitivity Level (MSL) for the TDA18264HB/C1?

The Moisture Sensitivity Level (MSL) for the TDA18264HB/C1 is 1 Unlimited.

What is the REACH status of the TDA18264HB/C1?

The REACH status of the TDA18264HB/C1 is REACH Unaffected.

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