| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
938 pcs
|
938 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name |
The TDA18225HN/C1 is an integrated circuit manufactured by NXP Semiconductors. This component falls under the Telecom IC subcategory within the broader Interface and Integrated Circuits (ICs) categories.
Key attributes include RoHS3 compliance, a Moisture Sensitivity Level (MSL) of 1 (Unlimited), and REACH Unaffected status. The part is supplied in bulk packaging.
This integrated circuit is suitable for applications within the telecommunications sector. Its compliance with RoHS3 standards indicates adherence to environmental regulations regarding hazardous substances. The MSL rating of 1 suggests it requires no special handling regarding moisture sensitivity during storage and assembly.
Further technical specifications such as operating voltage, operating temperature, and specific package details would typically be found in the manufacturer's datasheet. The part status is listed as Obsolete.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.26 | $1.26 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The RoHS status is RoHS3 Compliant.
The Moisture Sensitivity Level is 1 Unlimited.
The REACH status is REACH Unaffected.
The TDA18225HN/C1 is supplied in Bulk packaging.