| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,850 pcs
|
2850 pcs | On Request | 1 | On Request | On Request | 08+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Package / Case | |
| SVHC Present |
The TCC8322-01AX-IGR-AG from Telechips is a System On Chip (SoC) designed for embedded applications. This component comes in a BGA (Ball Grid Array) package, suitable for surface-mount assembly.
Key specifications include RoHS3 compliance, indicating adherence to environmental regulations regarding hazardous substances. It also carries a Moisture Sensitivity Level (MSL) of 1, meaning it has unlimited shelf life under recommended storage conditions and does not require special handling to prevent moisture absorption.
This SoC is part of Telechips' offerings in the embedded systems market. Its BGA package type suggests it is intended for high-density circuit designs where space efficiency is critical. Further technical details regarding operating voltage, temperature, and specific functionalities would typically be found in the manufacturer's datasheet.
The TCC8322-01AX-IGR-AG is RoHS3 Compliant.
The MSL for the TCC8322-01AX-IGR-AG is 1.
The TCC8322-01AX-IGR-AG comes in a BGA package.